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US Patent Issued to Tokyo Electron on July 14 for "Etching control system and etching control method" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,066, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Etching control system and etching control method" was invented by To... और पढ़ें


US Patent Issued to DISCO on July 14 for "Wafer processing method and wafer processing system" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,067, issued on July 14, was assigned to DISCO Corp. (Tokyo). "Wafer processing method and wafer processing system" was invented by Yuki Ino... और पढ़ें


US Patent Issued to Tokyo Electron on July 14 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,068, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing method and substrate processing apparatus" was i... और पढ़ें


US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Manufacturing method of the semiconductor package, pick and place device, and workpiece handling apparatus" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,069, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Manufacturing method of the semicon... और पढ़ें


US Patent Issued to Sandisk Technologies on July 14 for "Integrated die ejector for die attach ejector devices" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,070, issued on July 14, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Integrated die ejector for die attach ejector device... और पढ़ें


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Semiconductor wafer processing tool with improved leak check" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,071, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor wafer processing ... और पढ़ें


US Patent Issued to Kulicke and Soffa Hi-Tech on July 14 for "Working station systems for dispensing a fluid in connection with electronics assembly" (Taiwanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,072, issued on July 14, was assigned to Kulicke and Soffa Hi-Tech Co. Ltd. (New Tapei City, Taiwan). "Working station systems for dispensin... और पढ़ें


US Patent Issued to SEMES on July 14 for "Auto teaching apparatus including test substrate and auto teaching method using distance measuring sensor" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,073, issued on July 14, was assigned to SEMES Co. LTD. (Chungcheongnam-Do, South Korea). "Auto teaching apparatus including test substrate ... और पढ़ें


US Patent Issued to Applied Materials on July 14 for "Apparatus, systems, and methods of measuring edge ring distance for thermal processing chambers" (American, German Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,074, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Apparatus, systems, and methods of measuring edge ri... और पढ़ें


US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Method for mapping wafers in a wafer carrier" (Taiwanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,075, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Method for mapping wafers in a wafe... और पढ़ें